Embark on a challenge to design advanced packaging solutions using virtual prototyping techniques and numerical simulation CAE tools.
The 3rd edition of TIEµ will take on the 23rd of April 2026 at Technical University of Cluj-Napoca, Romania
Subject brief is published.
Asses the difficulty of the challenge and decide if you are up to the task.
Open until the 14th of March.
Full subject requirements are published. This marks the beginning of the 15 day period available to solve the challenge.
17th of March - 27th of March
Technical solution presentation.
Top contestants will be awarded with a certificate of competency.
3rd of April
