Chiplets & Heterogeneous Packaging Design and Simulation Challenge

Embark on a challenge to design advanced packaging solutions using virtual prototyping techniques and numerical simulation CAE tools.

The 1st edition of TIEµ will take place on the 25th of April 2024
at the Central Library of the “Lucian Blaga” University of Sibiu, Romania

Workflow

Registration


Subject brief is published.
Asses the difficulty of the challenge and decide if you are up to the task.

Open until the 31st of March.

Engineering Time


Full subject requirements are published. This marks the beginning of the 15 day period available to solve the challenge.

3rd of April - 17th of April

Final Stage


Technical solution presentation.
Top contestants will be awarded with a certificate of competency.

25th of April