• ECTC – Students’ Innovation Challenge

  Available Challenges

  Posted by Marcel on November 19, 2024 at 4:45 pm

  1. Predictive Modeling and Mitigation of Warpage in Optical MEMS Die attach process on PCB
  2. Modeling of CTE Mismatch Effects in Multi-Material Packages
  3. Approaches to Reduce Thermal Resistance and Improve Reliability of High-Temperature Power Electronics Modules
  4. Exploration of Thermal-Mechanical Challenges for Heterogeneously Integrated Opto-Electronic Packages
  5. Condition Monitoring Concept of Electronic
     Components or Systems

  Marcel replied 1 year, 9 months ago 1 Member · 0 Replies
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